Solid State Phenomena Vols. 108-109

Abstract: Different group IV impurities (Pb, C, and Sn) have been introduced in the melt during the growth of n-type Czochralski silicon. The samples have been irradiated with 1 MeV electrons to a fluence of 4x1015cm-2. The irradiation-induced defects have been studied by Deep Level Transient Spectroscopy (DLTS). It is shown that the formation of one of the irradiation-induced deep level is avoided by the Pb-doping. This level is located at 0.37 eV from the conduction band edge (EC) and shows an apparent capture cross-section of 7x10-15cm2. In addition, another irradiation induced deep level located at EC - 0.32 eV has been studied in more details.

Abstract: Hitherto unreported ESR signal, labeled TU10, was detected after annealing of electronirradiated silicon samples doped with phosphorus, iron and hydrogen. The ESR spectrum corresponds to a complex having monoclinic-I symmetry and S = 3/2 spin-state. Hyperfine structure of the TU10 spectrum suggests participation of two nucleus with spin I = 1/2 and 100% abundance in the core of the related defect. Doping of samples with hydrogen-deuterium mixture revealed presence of one hydrogen atom in the complex. The second nucleus with I = 1/2 is apparently a phosphorus atom. Presence of single iron atom was verified by doping with iron heaving modified isotope content. An intensity of the previously reported TU6 signal, related to iron-phosphorus complex, was significantly suppressed in hydrogen-doped samples.

Abstract: In this work, we investigate the effect of performing a high dose 20 keV He+ implant before the implantation of B at low energy (3 keV) in silicon and the subsequent thermal annealing at 800 °C. The implants were performed in laterally confined regions defined by opening windows in a SiO2 mask, in order to evidence the impact on a realistic configuration used in device fabrication. High resolution quantitative scanning capacitance microscopy (SCM) combined with cross-section transmission electron microscopy (XTEM) allowed to clarify the role of the voids distribution produced during the thermal annealing on the diffusion and electrical activation of implanted B in Si. Particular evidence was given to the effect of the uniform nanovoids distribution, which forms in the region between the surface and the buried cavity layer.

Abstract: The work aims at approaching the solution of the problem of developing sensitive silicon detectors for high speed IR imaging devices which are semiconductor – gas discharge systems. Among the requirements to detectors is their operation at the temperature which is somewhat higher than that of liquid nitrogen. To meet this requirement, a set of deep impurities is analyzed. It is emphasized that silicon doped with sulphur is a good choice to reach the aim. The doping of silicon with sulphur is done by the technique of high temperature diffusion. Data of the Hall measurements indicate the presence of large density of shallow donor levels in the material obtained. To compensate them, acceptors are introduced afterwards with using radiation doping techniques. Testing of the fabricated detectors in the converter setup shows that they provide imaging of IR fields of temperature T ~ 270 0C with the temporal resolution in the order of 3 µs.

Abstract: A theoretical modelling of the oxygen diffusivity in silicon, germanium and Si1-xGex (O) crystals both at normal and high hydrostatic pressure has been carried out using molecular mechanics, semiempirical and ab initio methods. It was established that the diffusion process of an interstitial oxygen atom (Oi) is controlled by the optimum configuration of three silicon (germanium) atoms nearest to Oi. The calculated values of the activation energy
Ea (Si) = 2.59 eV,
Ea(Ge) = 2.05 eV and pre-exponential factor D0(Si) = 0.28 cm2 s−1, D0(Ge) = 0.39 cm2 s−1 are in good agreement with experimental ones and for the first time describe perfectly the experimental temperature dependence of the Oi diffusion constant in Si crystals (T = 350–1200 °C). Hydrostatic pressure (P ≤ 80 kbar) results in a linear decrease of the diffusion barrier (∂P
Ea (P) = −4.38 × 10−3 eV kbar−1 for Si crystals). The calculated pressure dependence of Oi diffusivity in silicon crystals agrees well with the pressure-enhanced initial growth of oxygen-related thermal donors. The simulation (PM5) has revealed that in Si1-xGex crystals there are two mechanisms of variation of Oi diffusion barrier. The increase of lattice constant leads to the linear increase of the diffusion barrier. Strains around Ge atoms decrease the diffusion barrier. Formation of gradient of diffusion barrier in the volume of Si1-xGex may be responsible for the experimentally observed suppression of generation of TD in Si1-xGex (O) crystals.

Abstract: The in-diffusion of platinum into a low-doped n-type float zone silicon guided and enhanced by radiation damage produced by co-implantation of helium ions was investigated. The implantation of 1 MeV platinum ions at different doses ranging from 5×1011 to 3×1014 cm-2 was used to produce a finite source for platinum diffusion. Single and multiple energy implantation of helium ions with energies 7, 9, 11 and 13 MeV and doses from 5×1011 to 1×1013 cm-2 were applied to enhance and shape the diffusion of platinum atoms performed by 20 minutes annealing at 725°C in vacuum. Results show that diffusion of platinum at these conditions is fast enough to reach an equilibrium decoration of vacancy-related defects up to the depth of hundred micrometers. Analysis of the resulting platinum profiles indicates, that transformation of diffusing platinum interstitials to stable substitutional position is mainly given by Frank-Turnbull mechanism controlled by vacancy-related defects while the kick-out mechanism may play role at the peak of the radiation damage and at higher doses of helium implantation (>1012 cm-2). It is also shown that an extra annealing performed prior to helium implantation substantially increases the amount and localization of in-diffused platinum.

Abstract: Heavy species such as Sb, In, and Ge are required to meet the challenges of future dopant engineering in planar CMOS technology. An understanding of the interactions of these species with each other and with conventional dopants is urgently required in order to meet aggressive criteria for junction control in sub-sixty nanometer technology nodes. In the current work, the interactions between Sb and In have been explored as a function of ion implantation dose and annealing treatment. The data shows strong interaction between the two species which prevents the dissolution of an as-implanted In profile even after high temperature anneal. The nature of the interaction is probed with fundamental calculations using plane wave density functional theory. A strong binding for an Sb-In-vacancy complex is revealed. Band structure analysis indicates that this defect complex introduces several unoccupied states primarily in the upper half of the bandgap. The two species contribute with nearly equal magnitude to the top valence band.

Abstract: The effect of compressive and tensile plane-stress loading on formation energies and electronic properties of vacancies and divacancies in silicon are studied by first-principles approach for in-plane strains up to 0.7%. It is demonstrated that contributions to defect formation energies from the elastic lattice relaxation and from the band structure modification respond to stress in a different manner, leading to noticeable different behaviour of formation energies for different charges states. The most stable vacancy charge states at different Fermi level are shown to be sensitive to strain magnitude and sign. This results in the strain-induced shifts and even disappearance of some of thermal ionization levels of vacancies and divacancies in the band gap.