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Solid State Phenomena
Vol. 139

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Solid State Phenomena
Vol. 135

Solid State Phenomena
Vol. 134

Solid State Phenomena
Vols. 131-133

Solid State Phenomena
Vol. 130

Solid State Phenomena
Vol. 129

Solid State Phenomena
Vol. 128

Solid State Phenomena
Vol. 127

Solid State Phenomena
Vols. 124-126

HomeSolid State PhenomenaSolid State Phenomena Vol. 134

Solid State Phenomena Vol. 134

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134

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Table of Contents

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Paper Title Page

A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers

Authors: Laurent Souriau, V. Terzieva, Marc Meuris, Matty Caymax

83

Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions

Authors: Sylvain Garaud, Rita Vos, Denis Shamiryan, Vasile Paraschiv, Paul W. Mertens, Jan Fransaer, Stefan De Gendt

87

The Dynamic Aspects of Electrochemical Reaction Cells in Selectively Inducing Defects on Silicon Surface

Authors: Lie Yi Sheng, Johan De Greve, Eddy De Backer, Philippe Verpoort, Jan Ackaert, Filip Bauwens

91

Wafer Cleaning Using Supercritical CO₂ in Semiconductor and Nanoelectronic Device Fabrication

Authors: Koichiro Saga, Takeshi Hattori

97

All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid

Authors: Enrico Bellandi, Mauro Alessandri, Stefan Detterbeck, Sally Ann Henry, Leo Archer, Thomas Hellweg, Michael Kagerer, Ladislaus Brilz

105

All Wet Stripping of Implanted Photoresist

Authors: Kurt K. Christenson, Jeffery W. Butterbaugh, Thomas J. Wagener, Nam Pyo Lee, Brent Schwab, Michael Fussy, John Diedrick

109

Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist

Authors: G. Mannaert, Mikhail R. Baklanov, D. Goossens, Johann Vertommen, Werner Boullart

113

High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes

Authors: Karen A. Reinhardt, Khalid Makhamreh, George Tannous

117

Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications

Authors: Ingrid Vos, Stefan Peeters, Rita Verbeeck, Werner Boullart, Johann Vertommen

121

Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate

Authors: Enrico Bellandi, Annamaria Votta, Francesco Pipia, Matteo Ferrerio, Cinzia De Marco, Simone Alba, Mauro Alessandri

125

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