Solid State Phenomena Vol. 134

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134

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Paper Title Page

A Study of a Single-Wafer Process in Metal Contact Hole Cleaning

Authors: Jae Yong Park, Jong Kook Song, Han Mil Kim, Hee Kang Cho, Tae Gyun Kim, Bong Ho Moon, Eun Su Rho, Leo Archer, Won Ho Cho

177

The Active Role of Etch Products in Particle Removal by SC-1 Solutions

Authors: Alexander Pfeuffer, Wolfgang Bensch, Alfred Lechner, Harald Okorn-Schmidt

181

New FEOL Cleaning Technology for Advanced Devices beyond 45 nm Node

Authors: Hiroshi Tomita, Yuji Yamada, Hidenobu Nagashima, Norio Ishikawa, Yumiko Taniguchi

185

In Situ Particle Removal Studies Using an Optical Particle Counter

Authors: D. Martin Knotter, Roy Te Brake, Michiel Enkelaar

189

Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic

Authors: Guy Vereecke, T. Veltens, Atsuro Eitoku, Kenichi Sano, G. Doumen, Wim Fyen, Kurt Wostyn, James Snow, Paul W. Mertens

Abstract: Cleaning of nano-particles is becoming a major challenge in semiconductor manufacturing as efficient particle removal must be achieved without substrate loss and without damage to fragile structures. In this work cleaning performance and structural damage by a mixed fluid-jet technique were evaluated and directly compared to the performance of several megasonic systems. The test vehicles were hydrophilic Si wafers contaminated with 78-nm SiO2 particles and 70-nm poly-gatestack line patterned wafers. The results showed a broader process window for particle removal without damaging for the mixed fluid-jet technique compared to the megasonic systems.

193

Modeling of Shock Wave Emission during Acoustically-Driven Cavitation-Induced Cleaning Processes

Authors: Vincent Minsier, Joris Proost

197

Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes

Authors: Frank Holsteyns, Tom Janssens, Sophia Arnauts, Wouter Van der Putte, Vincent Minsier, Johann Brunner, Joachim Straka, Paul W. Mertens

201

New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge

Authors: Hajime Ugajin, Hayato Iwamoto, Eiji Hide, Nobuyasu Hiraoka, Tsuyoshi Okumura

205

Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic

Authors: Ji Hoon Cha, Chang Sup Mun, Dae Hyuk Kang, Woo Gwan Shim, Kuntack Lee, Chang Ki Hong, Han Ku Cho, Joo Tae Moon

209

Preparation, Characterization, and Damage-Free Processing of Advanced Multiple-Gate FETs

Authors: Jeffrey M. Lauerhaas, Rinn Cleavelin, Wei Ze Xiong, Koki Mochizuki, Kara Sherman, Hu Cheng Lee, Brian Clappin, Thomas Schulz, Klaus Schruefer

213