Solid State Phenomena Vols. 156-158

Abstract: Irradiation with high energy (500 keV) C+ ions at fluences from 11013 to 11014 cm-2 was used to introduce controlled amounts of defects in single layers of graphene deposited on a SiO2(100 nm)/n+Si substrate. Scanning Capacitance Spectroscopy (SCS) was used as non-destructive characterization technique to probe the effect of irradiation on the electrical properties of graphene. In particular, a comparative study between the local capacitance of pristine graphene and irradiated graphene is presented, showing that lateral variations in irradiated graphene are distinctly higher. The local quantum capacitance per unit area C’q of graphene was extracted from raw data. While a narrow distribution of C’q values was obtained in pristine graphene, two distinct distributions were obtained in irradiated monolayers, associated to locally damaged and not damaged regions, respectively.

Abstract: Electrically active defects induced by ion implantation of boron and phosphorus into silicon and their recovery under isothermal annealing at 450 °C were investigated using Deep Level Transient Spectroscopy (DLTS) and Energy Resolved Tunneling Photoconductivity (ERTP) spectroscopy at cryogenic temperatures. DLTS results show electrically active deep traps located at Ev+0.35 eV and Ev+0.53 eV in boron implanted Si and at Ev+0.34 eV, Ev+0.43 eV, and Ev+0.38 eV in phosphorus implanted Si. These meta-stable defect sites were found to be either eliminated or significantly reduced in thermally annealed samples. We assigned these defect sites to hydrogen and carbon incorporated complexes formed during ion implantation. Corroborating the DLTS results, the photocurrent measurement also revealed a strong reduction of electrically active defects states, extended from EC – 0.3 eV up to the conduction band edge of Si, upon isothermal annealing.

Abstract: Accumulation of hydrogen in Czochralski silicon implanted with N2+ (Si:N; N dose, DN=1–1.8x1018 cm-2; energy E=140 keV) or O2+ (Si:O; DO=1x1017 cm-2; E=200 keV), processed at up to 1400 K (HT) under enhanced Ar pressure, up to 1.2 GPa (HP), and followed by treatment in hydrogen (deuterium) plasma, was investigated by Secondary Ion Mass Spectroscopy. Implantation produces buried amorphous layer. As determined by transmission electron microscopy, subsequent HT-HP processing results in a formation of a specific sample microstructure. In plasma treated as-implanted Si:N, hydrogen accumulates at a depth of about 50 nm, up to concentration 2x1021 cm-3. This concentration is twice lower at a depth ≈ 80–250 nm. Deuterium content remains almost unchanged after plasma treatment of Si:N prepared by processing at 1270 K while it is strongly dependent on DN and on HP. In plasma treated Si:O, prepared by processing at 920-1230 K, hydrogen profile corresponds to that of implanted oxygen and decreases with HP. Comparative analysis of hydrogen accumulation and its subsequent release at 720-920 K in the Si:N and Si:O structures indicates that the capacity of buried layers in Si:O to getter and to preserve hydrogen is higher than that in Si:N.

Abstract: The influence of hydrogen on the structural stability of multilayers made of ultrathin (3 nm) Si and Ge amorphous layers submitted to annealing to activate Si and Ge intermixing has been studied by TEM and AFM. By energy dispersive microanalysis the interdiffusion of Si and Ge has been observed. The Si/Ge multilayers, however, underwent remarkable structural degradation because of the formation of hydrogen bubbles which give rise to surface bumps and eventually craters when the bubbles blow up because of too high internal pressure in samples with high H content and annealed at high temperatures. The hydrogen forming the bubbles comes from the rupture of the Si-H and Ge-H bonds activated by the thermal energy of the annealing and by the energy released by the recombination of thermally generated electron hole pairs.

Abstract: The electrical current-voltage (I-V) and capacitance-voltage (C-V) characteristics of Au/3C-SiC Schottky diodes were studied as a function of contact area. The results were correlated to defects in the 3C-SiC, which were studied and quantified by conductive atomic force microscopy (C-AFM). A method based on C-AFM was introduced that enables current-voltage characterization of diodes of contact radius down to 5 µm, which consequently allows the extraction of diode parameters for Schottky diodes of very small contact area.

Abstract: The influence of strongly absorbing N¬2 laser radiation on pores formation on a surface of Si single crystal has been investigated using optical microscope, atomic force microscope and photoluminescence. After irradiation by the laser and subsequent electrochemical etching in HF acid solution morphological changes of the irradiated parts of a surface of Si were not observed. At the same time, pores formation on the non-irradiated parts of Si surface took place. The porous part of the Si surface is characterized by strong photoluminescence in red part of spectra with maximum at 1.88 eV and intensity of photoluminescence increases with current density. Suppression of the pores formation by the laser radiation is explained with inversion of Si type conductivity from p-type to n-type. This fact is explained by Thermogradient effect – generation and redistribution of the intrinsic defects in gradient of temperature. It was shown that the depth of n-Si layer on p-Si substrate depends on intensity of laser radiation and it increases with intensity of laser radiation. The results of the investigation can be used for optical recording and storage of information on surface of semiconductors.

Abstract: In this contribution an overview of hydrogenation issues for (multi-)crystalline silicon material is given. Crystalline silicon material for photovoltaic application contains more defects than material used for other semiconductor device fabrication. Therefore passivation of bulk defects has to be performed to reach higher efficiencies and exploit the cost reduction potential of these materials. Especially minority charge carrier lifetimes of ribbon silicon can be drastically improved by hydrogenation in combination with a gettering step. Apart from bulk passivation atomic hydrogen plays an important role in surface passivation via dielectric layers. Performance of single dielectric layers or stack systems can be increased after a hydrogenation step. It is believed that hydrogen can passivate defects at the silicon/dielectric interface allowing for lower surface recombination velocities. In industrial application hydrogenation is performed via deposition of a hydrogen-rich PECVD SiNx layer followed by a belt furnace annealing step. Surface passivation for characterization of charge carrier bulk lifetime is often performed with the same technique, omitting the annealing step to avoid in-diffusion of hydrogen. It is shown that for some crystalline silicon materials even the PECVD SiNx deposition alone (without annealing step) can cause significant bulk defect passivation, which in this case causes an unwanted change of bulk lifetime.

Abstract: The influence of the hydrogen content in the amorphous starting material on hydrogen bonding and defect passivation in laser annealed polycrystalline silicon is investigated. The samples are characterized using electron paramagnetic resonance and hydrogen effusion measurements. After laser dehydrogenation and crystallization the samples contain a residual H concentration of up to 8×1021 cm-3. During a vacuum anneal at least 1.5×1021 cm-3 are mobile of which only 3.7×1018 cm-3 H atoms passivate preexisting Si dangling bonds. It is shown that a vacuum anneal can cause the vast majority of H atoms to accumulate in platelet-like structures. Defect passivation and platelet nucleation and growth occur spatially separated requiring long range H diffusion.

Abstract: In this work the impact of hydrogenation from hydrogen-rich amorphous silicon nitride (a-SiNx:H) on dislocations and grain boundaries in multi-crystalline silicon (mc-Si) solar cells is presented. Layers are deposited by means of plasma enhanced chemical vapor deposition (PECVD). Electrical bulk passivation is provided during thermal annealing, in which hydrogen diffuses from a-SiNx:H. The passivation effect is discussed in terms of recombination centers and non-recombinative charge traps reduction as well as in terms of local short circuit current improvement in specially manufactured solar cells.

Abstract: We investigated Si surfaces modified by wet-chemical and electrochemical treatments using pulsed photoluminescence (PL) and infrared spectroscopic ellipsometry during and after processing, both also in surface mapping techniques. Etching of oxidized Si surfaces by HF containing solutions lead to an enhancement in PL due to hydrogenation of the surface what improves the surface passivation and reduces the recombination loss of charge carriers via surface/interface states. PL measurements show that the H-terminated surface is attacked soon by HF or H2O species increasing again the recombination loss. Hence, a narrow time window for this type of processing exists. Nitrogen purging or exchanging the etching solution by a non-etching solution under negative bias decelerated the defect formation in HF solutions. Grafting of organic molecules (exchanging the H-Si by a C-Si bond) induces only small amounts of defects at the interface but stabilizes PL on a high level (i.e. surface recombination is low) for much longer times than for H-terminated Si surfaces.