Materials Science Forum Vols. 645-648

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Abstract: We measured the excess carrier lifetimes in as-grown and electron irradiated p-type 4H-SiC epitaxial layers with the microwave photoconductivity decay (-PCD) method. The carrier lifetime becomes longer with excitation density for the as-grown epilayer. This dependence suggests that e ≥h for the dominant recombination center, where e andh are capture cross sections for electrons and holes, respectively. In contrast, the carrier lifetime does not depend on the excitation density for the sample irradiated with electrons at an energy of 160 keV and a dose of 1×1017 cm-2. This may be due to the fact that recombination centers with e <<h were introduced by the electron irradiation or due to the fact that the acceptor concentration was decreased significantly by the irradiation.
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Abstract: The effect of various types of in-grown stacking faults and threading screw/edge type dislocations on carrier lifetime and diffusion lengths in 4H-SiC epitaxial films was investigated through cathodoluminescence decays and charge collection efficiencies of electron beam induced current signals at specific defects sites. Most stacking faults yielded ~40% reduction in the carrier lifetime. Moreover, drastic lifetime reductions were observed in regions containing surface triangular defects and bulk 3C polytype inclusions. Dislocations of both types serve as efficient recombination centers, though stronger reduction in diffusion lengths was observed in the vicinity of screw type dislocations.
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Abstract: We applied time-resolved free carrier absorption (FCA) to monitor non-equilibrium carrier dynamics in 4H epilayers and 3C SiC bulk crystals at excess carrier densities in the N = 1017 - 1019 cm-3 range. The numerical fitting of FCA decay kinetics provided the linear and nonlinear carrier recombination rates in the 40-390 K range and the absorption cross-sections eh at 1064 nm. In 4H, the decrease of the bulk lifetime (800 ns) with excitation provided the bimolecular and Auger coefficients B=(1.2±0.4)×10-12 cm3/s and C=(7±4)×10-31cm6/s, respectively, at room temperature. These values for 3C were 55-150 ns, (2.0±0.4)×10-12 cm3/s, and (2±1)×10-32 cm6/s, respectively. The rate of linear and nonlinear recombination increased at lower temperatures. A value of eh =4.4×10-18 cm2 for 3C SiC at 1.064 m was found 2.3 times smaller than that for 4H SiC.
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Abstract: Photoelectric properties of 3C sublimation-grown epitaxial layers with different structural quality were studied by using time-resolved picosecond transient grating and free carrier absorption techniques. The layer quality was described by a parameter LTW which gives the total length of twin boundaries in a layer. Optical measurements of diffusion coefficients and carrier lifetimes in wide excess carrier density (N >1018 cm-3) and temperature range (10 K to 300 K) revealed the twin defect density dependent ambipolar mobility value at RT as well as essentially different temperature dependences of mobility of the layers. The larger value of absorption cross section in more defective layer at 1064 nm wavelength pointed out to contribution of defect-assisted absorption, which gradually vanished after the filling defect states by free carriers.
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Abstract: We report here an anisotropic increase in SiC bulk resistivity by annealing at 1150 °C, and discuss the implications for SiC devices. The increase in resistivity is resistivity dependent and can be (at least) partially reversed by a subsequent anneal at higher temperature. Ideal device performance is achievable with appropriate annealing steps during device processing.
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Abstract: In this work we present the results of electrical characterization of 4H-SiC power Schottky diodes with a Mo metal barrier for high power applications. A comparison between different Schottky Barrier Height (SBH) evaluation methods (capacitance-voltage and current-voltage measurements), together with the comparison with other authors’ works, indicates that thermionic current theory is the dominant transport mechanism across the barrier from room temperature (RT) to 450K, while at T < 300K some anomalies in J-V curves appear and SBH and ideality factor significantly change their values. These deviations from ideality are attributed to Schottky barrier inhomogeneities. In particular, a model based on two SBHs seems appropriate to properly describe the electrical behavior of our devices.
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Abstract: An alternative approach based on non-equilibrium free-carrier density measurements was used to characterize the fundamental absorption edge of 3C-SiC at room and 77 K temperatures. At 77 K temperature the extracted absorption edge compared well to the previous literature data revealing characteristic thresholds due to the phonon emission assisted transitions. At room temperature the absorption tail due to the phonon absorption assisted transition was revealed up to the value of 0.01 cm-1 exceeding the previous 5 cm-1 limit induced by unintentional sample doping.
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Abstract: Femtosecond (fs) laser modification on single crystal silicon carbide (SiC) was studied from the viewpoints of electric conductivity. Fourier transform infrared (FTIR) spectroscopy was carried out on femtosecond laser modified area. The intensity decrease of reststrahlen band due to the modification was observed, and this decrease was explained by the degradation of crystallinity due to the laser irradiation. Polarization dependence of reststrahlen band was also observed on laser modified samples. Current-voltage characteristics and Hall measurements on fs-laser modified region were carried out by fabricating the metal contacts on the ion implanted areas. The specific resistance up to 5.9×10-2 m was obtained for fs-laser modified area.
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Abstract: Boron diffusion in boron-doped poly-Si/nitrogen-doped 4H-SiC structure was investigated by combining a reported model of poly-Si diffusion sources with the authors’ model of boron diffusion in 4H-SiC. By taking the limited supply of carbon interstitials at heterointerfaces into account, we determined a segregation coefficient of 4 to 8 and an activation energy of 0.20 eV in the temperature range of 650 to 1000°C.
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